Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.
Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.
Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.
Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.
A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.
Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.
Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.
Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.
Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.
Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.
An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.
Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.
Low temperature curing epoxy film adhesive. Good choice for substrate attachments.
