Bondline Datasheets & SDS

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Adhesives Characteristics

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Adhesives Characteristics

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Bondline 6050

Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.

Bondline 6150

High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.

Bondline 6175

Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.

Bondline 6200

Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.

Bondline 6250

Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.

Bondline 6275

A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.

Bondline 6276

A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.

Bondline 6382

A stress absorbing, casting epoxy adhesive. Light weight adhesive with a low dielectric constant. Specific gravity 0.61, Tg = 107° C.

Bondline 6460

Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.

Bondline 6485

Snap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing.

Bondline 6500

Rapid curing adhesive with a strong structural bond

Bondline 6501

Low outgassing, fast cure, epoxy adhesive

Bondline 6511

Low outgassing, fast cure, filled epoxy adhesive

Bondline 6515

Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series

Bondline 6555

Low outgassing epoxy adhesive, excellent for bonding semipourous material

Film Adhesive Datasheets

Bondline 9001

An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.

Bondline 9001 Datahseet

Bondline 8810

Temporary Thermoplastic Film Adhesive

Bondline 8810 Datahseet

Bondline 8366

Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.

Bondline 8366 Datasheet

Bondline 8360

Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.

Bondline 8360 Datasheet

bondline 8310

Dielectric, thermally conductive epoxy film adhesive

Bondline 8310 Datasheet

Bondline 8260

Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.

Bondline 8260 Datahseet

Bondline 8210

Electrically conductive epoxy film adhesive

Bondline 8210 Datasheet

Bondline 8060

Low temperature curing epoxy film adhesive. Good choice for substrate attachments.

Bondline 8060 Datasheet

Bondline 8010

Dielectric epoxy film adhesive

Bondline 8010 Datasheet

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