Bondline Datasheets & SDS

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Adhesives Characteristics

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Adhesives Characteristics

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Bondline 2080

Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.

Bondline 2106

Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.

Bondline 2111

Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.

Bondline 2120

Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.

Bondline 2121

Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.

Bondline 2156

A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.

Bondline 2158

A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.

Bondline 2258

Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.

Bondline 2485

Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.

Bondline 2490

Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.

Bondline 2900

Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.

Bondline 2900LV

Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.

Bondline 2920

New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.

Bondline 2948

Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.

Bondline 2949

Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Film Adhesive Datasheets

Bondline 9001

An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.

Bondline 9001 Datahseet

Bondline 8810

Temporary Thermoplastic Film Adhesive

Bondline 8810 Datahseet

Bondline 8366

Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.

Bondline 8366 Datasheet

Bondline 8360

Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.

Bondline 8360 Datasheet

bondline 8310

Dielectric, thermally conductive epoxy film adhesive

Bondline 8310 Datasheet

Bondline 8260

Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.

Bondline 8260 Datahseet

Bondline 8210

Electrically conductive epoxy film adhesive

Bondline 8210 Datasheet

Bondline 8060

Low temperature curing epoxy film adhesive. Good choice for substrate attachments.

Bondline 8060 Datasheet

Bondline 8010

Dielectric epoxy film adhesive

Bondline 8010 Datasheet

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