LOW TEMPERATURE CURE

Part #
Description
DATASHEET
MSDS
2072 Silver filled, snap cure, low outgassing epoxy adhesive. Electrical ground, low volume resistivity. Rapid cure 5min @ 125°C. Low temp. cure 20min @ 65°C.
2072
2072-MSDS
2080 Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006" needle. Low temp. cure.
2080
2080-MSDS
2106 Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.
2106
2106-MSDS
2111 Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006" needle. Low temp. cure.
2111
2111-MSDS
2120 Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
2120
2120-MSDS
2121 Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
2121
2121-MSDS
2160 Flexible, silver filled, Smart Card Adhesive.
2160
2160-MSDS
2258 Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.
2258
2258-MSDS
6050 Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95°C or 4 hrs @ room temp.
6050
6050-MSDS
6175 Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
6175
6175-MSDS
6350 Room temperature curing, casting epoxy adhesive.
6350
6350-MSDS
7247 Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/°C
7247
7247-MSDS
7247unf Unfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105°C.
7247UNF
7247UNF-MSDS